Egidio Marotta
TEES Associate Research Professor

Office: 315 Engineering/Physics Building
E-mail: emarotta@tamu.edu
Phone: 979.458.3580

Departmental website

CURRENT RESEARCH INTERESTS

* Micro-scale and Nano-scale Heat Transfer in Microelectronics
* Avionics Thermal Management
* Automotive Thermal Management
* Thermal Contact and Spreading Resistance
* Nano-scale Thermal Contact Resistance
* Thermal Transport in Ultra-Thin Polymeric Films

EDUCATION

*Ph.D., Texas A&M University, 1997, Mechanical Engineering
*M.S., Texas A&M University, 1994, Mechanical Engineering
*B.S., State University of New York at Albany, 1980, Chemistry

BACKGROUND

* TEES Associate Research Professor and Visiting Associate Professor - MechanicalEngineering Department, Texas A&M University, August 2003 - Present
* Adjunct Professor - Physics Department, SUNY at New Paltz, 2001 - 2003
* Adjunct Professor - Mechanical Engineering Department, Clemson University, 2000 - 2001
* Assistant Professor; Visiting Assistant Professor - Mechanical Engineering Dept., Clemson University, 1997-2001

RESEARCH

* Micro-scale and Nano-scale Heat Transfer in polymer thin films
* Thermal contact and spreading resistance in medals and polymers
* Microelectronic cooling

DISTINCTIONS

* Texas A&M-Mechanical Engineering Department nominee for University-level "Outstanding Graduate Student Teaching Award" (1996)
* Pi Tau Sigma (1998); Sigma Xi (1999)
* AIAA Thermophysics Graduate Student Best Technical Paper Award (2000, with student)
* IBM 1st Publication Award (2001)
* 1st Publication Plateau Award (2001)
* 2nd Publication Plateau Award (2002)
* 3rd Publication Plateau Award (2003)
* IBM 1st Patent Plateau Award (2002)
* 2nd Patent Plateau Award (2003)
* AIAA Associate Fellow (2003)

PATENTS

* Foil Heat Sink and Methods of Fabricating Same, U.S. Patent 6684501, 2004.
* Finned heat sink using copper-clad graphite foils, IBM Patent Filed, May 2002.
* Graphite-epoxy heat sink fins encased in thermally sprayed metal/alloy, IBM Patent Filed, January 2003.
* Graphite Composite Heat Sink with Mechanically Segmented Base for Solder/Epoxy Attach to a Metal Cap/Spreader, IBM Patent Filed, June 2004.

PUBLICATIONS (recent)

1. "Spreading Resistance and Contact Resistance", Yovanovich M.M. and Marotta, E.E., Chapter 4 of the Handbook of Heat Transfer, Editors: Bejan and Kraus, Wiley and Sons Inc. (July 2003).
   
2. Marotta, E.E., Ellsworth, M, Eberth, J., Mazzuca, S, "Thermal Performance of a Silicon Chip/Water Cooled Heatsink Assembly: Experimental Investigation," AIAA Journal of Thermophysics and Heat Transfer, 18, No. 2, pp. 193-203 (2004).
   
3. Srinivasan, S., Marotta, E.E., and Miller, R.S., "Parallel Computation of the Boltzmann Transport Equation for Microscale Heat Transfer in Multilayered Thin Films," Numerical Heat Transfer Part B: Fundamentals, 46, pp. 31-58, (2004).
   
4. Marotta, E.E., Mazzuca, S, and Norley, J., "Thermal Joint Conductance for Flexible Graphite Materials: Analytical and Experimental Study, IEEE-Transactions on Components and Packaging Technologies, (Accepted for Publication, (2004)).
   
5. Marotta, E.E., Ellsworth, M., Norley, J. and Getz, G. "The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers," IEEE-Transactions on Components and Packaging Technologies, September, 2003 (Tentative Acceptance -Revisions Required).
   
6. Setlur, P., Wagner, J., Eberth, J., Dawson, D., and Marotta, E.E., "Advanced Automotive Thermal Management Systems - Modeling and Control," IEEE/ASME Transactions on Mechatronics, June 2003 (Accepted for Publication - Feb. 2004).
   
7. Bahrami, M., Yovanovich, M.M., and Marotta, E.E., "Modeling of Thermal Joint Resistance of Polymer-Metal Rough Surfaces," IEEE-Transactions on Components and Packaging Technologies, August, 2004 (Submitted for Publication).